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EPS to EPS Foam Bonding with Hotmelt

06/19/08

Further information:

Champ 5 with GIA1051 Hot Melt

Beads of GIA1051 hot melt applied to different density EPS Foams.

Beads of GIA1051 at 334 F burn very little into substrate.

GIA1051 has a long open time that also gives good initial tack.

Bond between substrates is repositionable.

Bonds between EPS foams are permanent and destructible bonds.

Post tags: adhesives, Champ 5, hot melt
Posted in: Champ Hot Melt Glue Guns | | Comments (0)

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